Qualcomm apparently has a working rendition of the Snapdragon 898 chipset already, and a report by Gizchina says that its first benchmarks are out.
The article goes on to say that the upcoming SoC will indeed be very powerful, scoring 20% higher in benchmarks compared to its predecessor, the Snapdragon 888. However, like the latter, the Snapdragon 898 is also a very hot processor.
This was an issue posed by the SD 888 when it first launched, and reviewers including us noted that phones packing this chipset would warm up too much while gaming, making the device uncomfortable to hold.
This is despite it being built on a smaller 4nm process compared to the SD 888, and the only saving grace now would be to have smartphone manufacturers try and innovate in the cooling department, and create a system that can tame the beast of a SoC.
For the meantime, let’s focus on Snapdragon flagship chip that exists now which is the SD 888+ – we’ll be seeing this in the HONOR Magic3 series as well as the Xiaomi Mi Mix 4, and we’re excited to see how it stacks up against its troublesome predecessor.